EAN 9780412084515

MICROELECTRONICS PACKAGING HANDBOOK. Part 3, subsystem packaging, 2nd edition, édition en anglais

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EAN	9780412084515
Last Scan	Jan 18 2025 at 11:33 PM
Description	Book by Tummala RR Rymaszewski Eugene J Klopfenstein Alan
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$22.98 (BetterWorld.com - New, Used, Rare Books & Textbooks)

Microelectronics Packaging Handbook, 3-Part Set: Part III: Subsystem Packaging

$249.99 (Barnes & Noble)

Microelectronics Packaging Handbook: Subsystem Packaging Part III R.R. Tummala Author

$324.95 (Indigo Books & Music)

Microelectronics Packaging Handbook: Subsystem Packaging Part III

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